Title:
FLIP-CHIP TYPE SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP3773022
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To improve reliability by sealing an underfilling part with a liquid epoxy resin composition superior in clearance permeation and by packaging a fillet part, with a sealing material which is smaller in expansion factor than that used for the under-filling part.
SOLUTION: In this flip-chip type semiconductor device, a semiconductor chip 3 is mounted to the surface of a board 1 via a plurality of bumps 2 interposed, and an underfilling material 4 is filled into a clearance between the board 1 and the semiconductor chip 3 and its side is sealed by a fillet material 4. The under-filling material 4 is made of an epoxy resin composition, whose expansion factor at a glass transition temperature or lower is 20-40 ppm/°C, and the fillet material 5 is made of epoxy resin composition whose expansion factor at the same condition is 20 ppm/°C or lower.
Inventors:
Kazumasa Sumita
Kimitaka Kumagai
Wakao Sachi
Toshio Shiobara
Kimitaka Kumagai
Wakao Sachi
Toshio Shiobara
Application Number:
JP2000023751A
Publication Date:
May 10, 2006
Filing Date:
February 01, 2000
Export Citation:
Assignee:
Shin-Etsu Chemical Co., Ltd.
International Classes:
H01L21/60; C08G59/40; C08G59/62; H01L21/56; H01L23/29; H01L23/31; (IPC1-7): H01L23/29; H01L23/31; C08G59/40; C08G59/62; H01L21/56; H01L21/60
Domestic Patent References:
| JP10199936A | ||||
| JP7122684A | ||||
| JP4351630A |
Attorney, Agent or Firm:
Takashi Kojima
Saori Shigematsu
Katsunari Kobayashi
Takeshi Ishikawa
Saori Shigematsu
Katsunari Kobayashi
Takeshi Ishikawa
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