To provide a floating transfer-type heating device capable of transferring a substrate while heating it, without causing uneven drying of a coating film.
A floating transfer-type heating device comprises: a diaphragm part 2 which causes a substrate to float by ultrasonic vibrations; a heater part 3 which heats the diaphragm part; an ultrasonic wave generation part 4 which applies ultrasonic vibrations to the diaphragm part; and a transfer part 5 which supports an end of the substrate and transfers the substrate in a direction perpendicular to a floating direction of the substrate. The heater part 3 is arranged, at a predetermined distance from the diaphragm part 2, on the rear side of a surface of the diaphragm part 2 over which the substrate is floated. The dimension of the diaphragm part 2 in a direction orthogonal to a transfer direction of the substrate is larger than the dimension of a substrate W in the same direction. When the diaphragm part 2 is heated by the heater part 3, the entire surface of the substrate W being floated and transferred is heated by the diaphragm part 2.
OKUDA DAISUKE
OKAMOTO SHUNICHI
UCHIGATA TOMOO
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