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Patent Searching and Data


Title:
FLOOR FACE WIRING SYSTEM
Document Type and Number:
Japanese Patent JPH05292632
Kind Code:
A
Abstract:

PURPOSE: To realize ultra-low floor face wiring by laying wiring panels having supports on the right and left and front and rear at predetermined interval on a floor face with the supports directing upward and then laying wiring groups for OA machines, without crossing each other, between the supports.

CONSTITUTION: A wiring panel 2 having supports 21, arranged on the right and left and front and rear at predetermined intervals while being coupled through beam parts 22, is laid on the top face of a muffler mat 1 placed on the floor face with protrusions 23 on the wiring panel 2 directing upward. Feeder lines (a) and data lines (b) for OA machines are then laid between the supports 21 without crossing each other. Upon finish of wiring, a stainless steel flat panel 3 having holes 31 to be engaged with the protrusions 23 is laid and then a tile carpet 4 is laid thereon. The feeder lines (a) are extended from a power supply receptacle 5 to positions for installing the OA machines and pop-up receptacles 7 are connected therewith. The pop-up receptacles 7 are secured in place by making holes through the flat panel 3 and the carpet 4. The data lines (b) from a data head 8 detours the feeder lines (a). According to the system, ultra-low floor face wiring is realized.


Inventors:
NISHIMURA TAKAMASA
MAMIYA NOBUO
ATOOKA KENJI
NAITO SHUNICHI
Application Number:
JP12005592A
Publication Date:
November 05, 1993
Filing Date:
April 13, 1992
Export Citation:
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Assignee:
NITTO DENKO CORP
LION OFFICE PROD
TAKU KENCHIKU KOUZOU SEKKEI KK
International Classes:
H02G3/30; (IPC1-7): H02G3/26
Attorney, Agent or Firm:
Matsukatsu Mikatsu