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Title:
FLOOR HEAT-INSULATION BOARD AND FLOOR HEAT-INSULATION STRUCTURE
Document Type and Number:
Japanese Patent JP2012154087
Kind Code:
A
Abstract:

To provide a floor heat-insulation structure having a floor heat-insulation board of which both ends are hanged on neighboring sleepers 4 and 4 so as to be inserted between neighboring floor joists 5 and 5, capable of preventing a heat insulation loss caused by presence of the floor joist 5.

A floor heat-insulation board 1a includes a central portion having a thickness larger than the height of a floor joist 5, hanger portions 2 and 2 composed of upper portions of both ends with cut-out lower portions for hanging on sleepers 4 and 4, and an extension portion 3 composed of a lower portion of one side edge with a cut-out upper portion for insertion into contact with the underside of the floor joist 5. In a floor heat-insulation structure, a plurality of the floor heat-insulation boards 1a with extension portions 3 arranged in the same direction and with hanger portions 2 and 2 hanged on the neighboring sleepers 4 and 4 are inserted between the neighboring floor joists 5 and 5, such that the extension portion 3 is inserted into contact with the underside of one of the neighboring floor joists 5 and 5.


Inventors:
MIHARA NORIMASA
HIRAKAWA HIDEKI
KIMURA YOSHIHARU
MATSUMOTO TAKASHI
Application Number:
JP2011013603A
Publication Date:
August 16, 2012
Filing Date:
January 26, 2011
Export Citation:
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Assignee:
DOW KAKO KK
International Classes:
E04B1/80; E04F15/18
Domestic Patent References:
JPS55143307U1980-10-14
JPH0578721U1993-10-26
JP2001011972A2001-01-16
JP2007321532A2007-12-13
Attorney, Agent or Firm:
Keisuke Watanabe
Yoshihiro Yamaguchi