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Title:
FLOOR HEAT INSULATOR
Document Type and Number:
Japanese Patent JP2013249586
Kind Code:
A
Abstract:

To provide a floor heat insulator that quickly removes moisture adhered to a supporting material, and prevents mold for a long period of time.

A floor heat insulator 10 is disposed between frame bodies 1, 1 forming a floor structure, and below a floor face bar 2. The floor heat insulator 10 comprises: an inorganic fiber mat 20 of an inorganic fiber with a binder including a water repellent; and a sheet-like supporting material 30 of a nonwoven fabric including an organic fiber, which is long enough to adhere to the bottom surface of the inorganic fiber mat 20, to extend in a direction of both widths of the inorganic fiber mat 20, to cover both sides of the inorganic fiber mat 20, and to extend to form flange-like ear parts. The inorganic fiber mat 20 has volume water absorption of 10% or less when soaked in water for 24 hours. The supporting material 30 is constituted of a nonwoven fabric of an olefin resin fiber and/or a fluorine resin fiber.


Inventors:
IKEDA MASAHIKO
SUGIURA KENTARO
INOUE AKIRA
Application Number:
JP2012123032A
Publication Date:
December 12, 2013
Filing Date:
May 30, 2012
Export Citation:
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Assignee:
ASAHI FIBREGLASS CO
International Classes:
E04B1/80
Domestic Patent References:
JP2008196270A2008-08-28
JP3746455B22006-02-15
JP2863585B21999-03-03
Attorney, Agent or Firm:
Shigeru Matsui



 
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