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Title:
FLOOR HEATING PANEL
Document Type and Number:
Japanese Patent JP2013145070
Kind Code:
A
Abstract:

To improve workability in connecting adjacent heat medium pipes of a floor heating panel, and to simplify a structure.

A floor heating panel includes a heat medium pipe 2 to be a flow path of a heat medium, and a base member 10 in a substantially rectangular flat plate shape provided with a pipe recessed groove 11 on its upper surface 10a side, a corner part on an upper surface side of the base member being provided with a housing recess 12 of a connection part 3 connecting adjacent heat medium pipes of the floor heating panel, and includes a cover 20 in a substantially rectangular flat plate shape which covers the housing recess so that adjacent two ends 21, 22 are located respectively along both two sides 15, 16 of a corner part of the base member, and for which one side end 23 of remaining two side ends 23, 24 is turnably held on the upper surface side of the base member, and a soaking sheet 25 which includes an upper surface 20a of the cover to cover the upper surface side of the base member, and is provided with a notch 26 to be placed along another side end 24 of remaining two side ends of the cover. The soaking sheet is turnable together with the cover.


Inventors:
SHINDO NORITAKA
HOTTA TOSHIRO
Application Number:
JP2012005141A
Publication Date:
July 25, 2013
Filing Date:
January 13, 2012
Export Citation:
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Assignee:
PANASONIC CORP
International Classes:
F24D3/16
Domestic Patent References:
JP2007139378A2007-06-07
JP2003222345A2003-08-08
JPH0659711U1994-08-19
JPS60159922U1985-10-24
JPH1137482A1999-02-12
JPH09145072A1997-06-06
JP2001141251A2001-05-25
JPH08338639A1996-12-24
JPS59191507U1984-12-19
Attorney, Agent or Firm:
Hiroyuki Nakai
Okumura Kimitoshi
Shuko Okimoto



 
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