Title:
FLOOR HEATING STRUCTURE
Document Type and Number:
Japanese Patent JP2006105493
Kind Code:
A
Abstract:
To provide a floor heating structure with excellent heat storing performance as well as excellent workability and construction property, capable of keeping a comfortable living environment while suppressing power consumption.
The floor heating structure comprises a heat storage layer, a planar heating layer and a floor material layer laminated. The heat storage layer contains a heat storing microcapsule having a latent heat storage material included in a capsule wall obtained by polymerizing a specified crystalline vinyl monomer.
Inventors:
AMANO RYOTARO
Application Number:
JP2004293369A
Publication Date:
April 20, 2006
Filing Date:
October 06, 2004
Export Citation:
Assignee:
SK KAKEN CO LTD
International Classes:
F24D11/00; C09K5/06; F24D13/02
Domestic Patent References:
JP2003074883A | 2003-03-12 | |||
JP2004244513A | 2004-09-02 | |||
JP2004203978A | 2004-07-22 | |||
JP2001181611A | 2001-07-03 | |||
JP2003221578A | 2003-08-08 |
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