To provide a floor material cutting machine capable of easily and rapidly removing a floor material bonded on a floor while reducing noises associated with removal work of the floor material, and a floor material separating method.
A floor material cutting machine 1 for cutting a floor material bonded on a floor or making a cut in a surface of the floor material includes: a body 2; at least one cutting blade fixed to the body 2 so as to contact with the floor material when the floor material cutting machine 1 is arranged on the floor material; at least one wheel 4 rotatably fixed to the body 2 so as to contact with the floor material when the floor material cutting machine 1 is arranged on the floor material, and configured so as to move the body 2 and the cutting blade; a handle 5 fixed to the body 2 and extending from the body 2; and a cutting depth adjustment mechanism configured so as to adjust a cutting depth of the cutting blade.
ABE KAZUHIRO
| JP2010201513A | 2010-09-16 | |||
| JP2004137690A | 2004-05-13 | |||
| JPH0325744U | 1991-03-15 | |||
| JP2006026878A | 2006-02-02 | |||
| JP2011226168A | 2011-11-10 | |||
| JP2010201513A | 2010-09-16 |
Tetsuro Shimada
Shinji Mitsuhashi
Tone Yuuki
Koichi Ito
Kentaro Ito
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