Title:
FLOOR PANEL, ITS MANUFACTURING METHOD, AND FLOOR STRUCTURE USING IT
Document Type and Number:
Japanese Patent JP3915000
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a floor panel, its manufacturing method and floor structure using the floor panel contributing to the floor structure simplified in construction and attaining a high degree of heat insulating property while solving every problem of wooden floor structure.
SOLUTION: This floor panel 60 is provided with a floor board 40; steel joists 30 disposed in prescribed arrangement on the back face of the floor board 40; a heat insulating member 50 disposed on the back face of the floor board 40 while covering the steel joists 30; and a heat insulating strength member 52 disposed in the abutting position of the heat insulating member 50 against a sleeper 20. The manufacturing method of the floor panel 60 comprises a procedure of disposing the steel joists 30 in the prescribed arrangement on the back face of the floor board 40; a procedure of disposing the heat insulating member 50 on the back face of the floor board 40 while covering the steel joists 30; and a procedure of disposing the heat insulating strength member 52 in the abutting position of the heat insulating member 50 against the sleeper 20.
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Inventors:
Yoshiaki Ashikaga
Application Number:
JP2002310465A
Publication Date:
May 16, 2007
Filing Date:
October 25, 2002
Export Citation:
Assignee:
Tsuka Kanamono Co., Ltd.
International Classes:
E04B5/02; E04B5/43; E04F15/00; (IPC1-7): E04B5/02; E04B5/43; E04F15/00
Domestic Patent References:
JP9195432A | ||||
JP2292443A | ||||
JP76254Y2 | ||||
JP2001152607A | ||||
JP200073527A | ||||
JP6193174A | ||||
JP2000265609A | ||||
JP2000144998A | ||||
JP8004253A |
Attorney, Agent or Firm:
Taro Sosogi