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Title:
FLOOR PANEL AND FLOOR STRUCTURE USING THE FLOOR PANEL
Document Type and Number:
Japanese Patent JP2008095431
Kind Code:
A
Abstract:

To provide a floor panel which is high in sound insulation properties, contributes to uniform room heating effect and improved room heating efficiency, and facilitates construction and maintenance thereof, and to provide a floor structure using the floor panel.

The floor structure 2 is set up by laying a number of floor panels 10 on a base floor 4. Each floor panel 10 is formed of an impermeable floor material 12 being cut to a predetermined dimension, and a cushion material 11 bonded to a lower surface of the floor material 12. The cushion material 11 is formed with support threads each having upper and lower edges thereof to upper and lower net portions and diagonally arranged in predetermined directions. Then the periphery of the entire cushion materials of the floor panels 10 continuously laid on the basic floor 4 is blocked, and a peripheral blocking portion has formed therein an air introducing opening and an air discharging opening, to thereby secure an air passage inside the cushion materials 11. Further an air conditioner air blowout port 31 of an air conditioner unit 30 is connected to the air introducing opening.


Inventors:
TAUCHI SOUSHI
YAMAMOTO OSAMU
NAKABAYASHI SHIZUO
NAGAMINE FUMIO
ANASAKO YASUYUKI
Application Number:
JP2006280331A
Publication Date:
April 24, 2008
Filing Date:
October 13, 2006
Export Citation:
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Assignee:
NITTO BOSEKI CO LTD
EREHON KASEI KOGYO KK
NAKABAYASHI KOGYO KK
International Classes:
E04F15/18; E04B5/43; E04B5/48; E04F15/02; F24D5/08; F24D5/10
Attorney, Agent or Firm:
Mamoru Aikawa