Title:
FLOOR PANEL
Document Type and Number:
Japanese Patent JP2711240
Kind Code:
B2
Abstract:
PURPOSE: To provide a floor panel that is lightweight and easily producible while being sufficiently rigid even produced in thin thickness, greatly effective in sound insulation, and available for easy installation.
CONSTITUTION: In a floor panel 1 made up by joining a steel surface plate 2 and a steel reverse plate 3 together at their edges, a space between the surface plate 2 and the reverse plate 3 is sealed up with a filler 4 composed of porous inorganic granular bodies an aggregates. An inorganic cementitious filler formed of mortar mixed with granular pearlite is suitable as the filler 4 for filling the space between the surface plate 2 and the reverse plate 3.
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Inventors:
Hiromasa Naka
Norio Nakamura
Takehiko Okushima
Takao Okumura
Shoji Tatsuo
Norio Nakamura
Takehiko Okushima
Takao Okumura
Shoji Tatsuo
Application Number:
JP34261195A
Publication Date:
February 10, 1998
Filing Date:
December 28, 1995
Export Citation:
Assignee:
Naka Kogyo Co., Ltd.
NTT Urban Development Co., Ltd.
NTT Urban Development Co., Ltd.
International Classes:
E04F15/024; (IPC1-7): E04F15/024
Domestic Patent References:
| JP6198843A | ||||
| JP60177215U |
Attorney, Agent or Firm:
Jun Tsuda (3 others)
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