To provide a floor polish composition for a flooring floor, excellent in adhesion, water-resistance and water-resisting adhesion and, as forming a floor polish composition film low in surface electrical resistance, so little in dust adhesion due to static electricity.

The floor polish composition for a flooring floor comprises (A) a polyurethane resin dispersant containing a carboxylic acid and/or a carboxylate salt and having 10-38 acid value (Av), (B) an acrylic-styrene copolymer resin emulsion, (C) a colloidal silica, (D) a wax emulsion, (E) an alkali-soluble resin, (F) a plasticizer, (G) a film-forming auxiliary agent and (H) water.