Title:
FLOOR SLAB STRUCTURE FOR APARTMENT HOUSE
Document Type and Number:
Japanese Patent JP2023120538
Kind Code:
A
Abstract:
To provide a floor slab structure for an apartment house, which suppresses noise from equipment piping to a dwelling unit and allows the piping route of equipment piping to be changed relatively easily when renewing a dwelling unit.SOLUTION: A floor slab structure of an apartment house is a floor slab structure of an apartment house with three or more floors, including a dwelling unit floor slab 35 installed in a dwelling unit 30, and a dwelling floor slab 22 provided in a common hallway 20 and connected to the dwelling unit floor slab 35. The dwelling floor slab 22 includes a low floor portion 23 constructed on the dwelling unit 30 side and a high floor portion 24 constructed at a higher position than the low floor position 23 on the opposite side of the dwelling unit 30 and is connected to the low floor portion 23 by a wall portion 25 extending in the vertical direction. A floor material 28 is provided on the low floor portion 23 to form a double floor 26. Equipment piping 100 of the apartment house is arranged from above the dwelling unit floor slab 35, via the double floor 26 of the low floor portion 23, through the wall portion 25, to below the high floor portion 24.SELECTED DRAWING: Figure 3
Inventors:
SEIRYU TADAKUNI
WATANABE TOMOSUKE
KAWAMOTO SHINICHIRO
KAWASAKI MASAYA
TANIGUCHI AKIRA
WATANABE TOMOSUKE
KAWAMOTO SHINICHIRO
KAWASAKI MASAYA
TANIGUCHI AKIRA
Application Number:
JP2022023477A
Publication Date:
August 30, 2023
Filing Date:
February 18, 2022
Export Citation:
Assignee:
TAISEI CORP
International Classes:
E04B5/48; E03C1/122; E04H1/04
Attorney, Agent or Firm:
Sonoda & Kobayashi Patent Attorneys Corporation