Title:
FLOOR STRUCTURE OF BUILDING
Document Type and Number:
Japanese Patent JP3837927
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide floor structure at a low cost, in which the rate of heat dissipation in the direction of the floor upper section of a heating element can be increased.
SOLUTION: The floor structure of the building has a floor slab 11, a support plate 14 disposed onto the floor slab, a heating element 15 for indoor heating supported by the support plate 14 and a floor finishing material 16 arranged on the heating element under the state, in which the floor finishing material 16 is brought into contact with the heating element. An air layer 13 is installed between the floor slab and the support plate at that time, and a radiation interrupting material 12 is arranged to the air layer so that a radiating surface is faced oppositely to the underside of the support plate 14.
Inventors:
Tomio Inoue
Toshimichi Kitaoka
Tomoo Danguri
Atsushi Kusaka
Toshimichi Kitaoka
Tomoo Danguri
Atsushi Kusaka
Application Number:
JP23176598A
Publication Date:
October 25, 2006
Filing Date:
August 18, 1998
Export Citation:
Assignee:
OSAKA GAS CO.,LTD.
International Classes:
E04F15/18; F24D3/14; (IPC1-7): E04F15/18; F24D3/14
Domestic Patent References:
| JP10106730A | ||||
| JP6058566A | ||||
| JP868185A |
Attorney, Agent or Firm:
Eiji Saegusa
Kakehi Yuro
Takeshi Ohara
Hiroji Nakagawa
Yasumitsu Tate
Kenji Saito
Jun Fujii
Hitoshi Seki
Mutsuko Nakano
Shinsuke Otsuki
Suzuki Katsuto
Kakehi Yuro
Takeshi Ohara
Hiroji Nakagawa
Yasumitsu Tate
Kenji Saito
Jun Fujii
Hitoshi Seki
Mutsuko Nakano
Shinsuke Otsuki
Suzuki Katsuto
Previous Patent: ROTATION ELECTRONIC PART AND ELECTRONIC APPARATUS USING IT
Next Patent: MEMBER FOR RESIN MOLDING DEVICE AND MANUFACTURE THEREOF
Next Patent: MEMBER FOR RESIN MOLDING DEVICE AND MANUFACTURE THEREOF