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Patent Searching and Data


Title:
FLOORING MATERIAL FOR FLOOR HEATING
Document Type and Number:
Japanese Patent JP2002295854
Kind Code:
A
Abstract:

To obtain a flooring material for floor heating that can easily and surely conduct nailing fixation to a subfloor.

In a flooring material 1, where a recessed groove 11 for incorporating a heat generation source 20, such as pipe for hot water and an electric heater, is set as back side, a distance A from a side end 17 where tenon 13 is formed to a recessed groove 11A, and distance B from a side end 18, where a mortise 14 is formed to a recessed groove 11B are expressed as A>B (or A<B), and A+B=C (the distance between recessed grooves 11).


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Inventors:
INOUE TAKAO
YAMADA KAZUHIRO
Application Number:
JP2001093169A
Publication Date:
October 09, 2002
Filing Date:
March 28, 2001
Export Citation:
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Assignee:
EIDAI CO LTD
International Classes:
E04F15/02; E04F15/18; F24D3/16; F24D13/02; (IPC1-7): F24D3/16; E04F15/02; E04F15/18; F24D13/02
Attorney, Agent or Firm:
Yusuke Hiraki (1 person outside)