Title:
フローフィールドプレート及びそれらの間のシール形成方法
Document Type and Number:
Japanese Patent JP2004536424
Kind Code:
A
Abstract:
A flow field plate having a plurality of protrusions formed integrally on at least on surface, said protrusions being adapted in use to join the flow field plate to an adjacent flow field plate. The material of the plate may be an electrically conductive polymer, which may comprise a conductive filler and carbon nanofibres. The plates may be welded together by ultrasonic welding.
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Inventors:
Turpin, Mark Christopher
Boff, James Charles
Bilton, Brendan Michael
Boff, James Charles
Bilton, Brendan Michael
Application Number:
JP2002588660A
Publication Date:
December 02, 2004
Filing Date:
April 16, 2002
Export Citation:
Assignee:
THE MORGAN CRUCIBLE COMPANY PLC
International Classes:
C25B9/00; C25B9/04; H01M8/02; H01M8/10; H01M8/24; (IPC1-7): H01M8/02; H01M8/10; H01M8/24
Attorney, Agent or Firm:
Michiteru Soga
Michiharu Soga
Hidetoshi Furukawa
Suzuki Kenchi
Kajinami order
Nakamura Rei
Michiharu Soga
Hidetoshi Furukawa
Suzuki Kenchi
Kajinami order
Nakamura Rei