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Title:
流量計測システム、流量計測装置および流量計測方法
Document Type and Number:
Japanese Patent JP7111014
Kind Code:
B2
Abstract:
To provide a flow rate measuring system, a flow rate measuring device and a flow rate measuring method with which it is possible to obtain the velocity of a fluid flowing in a piping without the need for installing a heater on the outside surface of wall part of the piping.SOLUTION: The flow rate measuring device comprises: a laser beam irradiation unit for irradiating, with a laser beam, one laser irradiation point on the outside surface of a wall part of a piping in which a fluid flows; a temperature distribution calculation unit for calculating a temperature distribution on the outside surface irradiated with a laser beam by the laser beam irradiation unit; a heat transfer numerical analysis-CFD analysis unit for outputting a relationship between at least the velocity of a fluid flowing inside of the piping and the temperature distribution on the outside surface, on the basis of information pertaining to the piping; and a fluid velocity calculation unit for calculating the velocity of the fluid flowing inside of the piping, on the basis of the temperature distribution on the outside surface calculated by the temperature distribution calculation unit and the relationship outputted by the heat transfer numerical analysis-CFD analysis unit.SELECTED DRAWING: Figure 1

Inventors:
Shuichi Umezawa
Katsuhiko Sugita
Makoto Onodera
Application Number:
JP2019019470A
Publication Date:
August 02, 2022
Filing Date:
February 06, 2019
Export Citation:
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Assignee:
TEPCO Holdings Co., Ltd.
International Classes:
G01F1/688; G01P5/10
Domestic Patent References:
JP6686335B2
JP6657689B2
JP6229521B2
JP6500585B2
JP5336503B2
Attorney, Agent or Firm:
Yasushi Matsunuma
Junichi Kobayashi
Kazunori Onami
Masahisa Matsumoto
Hiroyuki Matsumoto



 
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