Title:
FLOW RATE MONITORING DEVICE, FLOW RATE MONITORING METHOD, AND PROGRAM
Document Type and Number:
Japanese Patent JP2022179076
Kind Code:
A
Abstract:
To provide a flow rate monitoring device, etc. that can monitor the flow rate of a heat medium cooling a heating member while suppressing an increase in size of equipment to which the heating member is installed.SOLUTION: A device according to an aspect of the present disclosure, in an information processor to which a plurality of modules including an electronic circuit board including a heating member and a cooling member that is a member receiving heat from the heating member that cools the heating member by using a heat medium are installed, comprises acquisition means for acquiring a calorific value of a first module, a first temperature that is a temperature of a heating member of a first module, and a second temperature that is a temperature of a heating member of a second module, if the heat medium discharged from a cooling member of the first module among a plurality of modules is supplied to the second module among the plurality of modules and estimation means for estimating the flow rate of the heat medium to be supplied to the first module based on the calorific value of the first module, the first temperature, and the second temperature.SELECTED DRAWING: Figure 3
Inventors:
NAKAMURA YASUHITO
Application Number:
JP2021086319A
Publication Date:
December 02, 2022
Filing Date:
May 21, 2021
Export Citation:
Assignee:
NEC PLATFORMS LTD
International Classes:
G05D23/00; G05D23/19
Domestic Patent References:
| JP2015079843A | 2015-04-23 | |||
| JP2015059465A | 2015-03-30 | |||
| JP2013228300A | 2013-11-07 |
Attorney, Agent or Firm:
Desk
Keiji Kitajima
Keiji Kitajima
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