Title:
FLOW TYPE SOLDERING DEVICE
Document Type and Number:
Japanese Patent JP3926084
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To solve problems that it is necessary to supply a large quantity of insert gas due to generation of the unnecessary flow of an atmosphere in the inside of a tunnel shaped chamber when blowing hot air when preheating a printed circuit board in a flow type soldering device equipped with the tunnel shaped chamber in which the oxygen concentration is made low in addition to this, an oxygen content varies unstably, and lift-off failures are liable to occur when leadfree solder is used.
SOLUTION: By providing the supply body 26 of N2 gas for cooling at the latter stage nearest to a peel back pint 36 at which the printing circuit board 1 is separated from jet stream wave 25 melted solder 11 to spray the cooling N2 gas, and the circuit board cool. This cooling N2 gas is collected by a gas collection port 37, after the circuit board is heated by the melted solder 11 during it passes through a pipe 38 provided inside a solder bath 12, it is heated further by a heater 14 for heating an atmosphere, and is used for preheating the printed circuit board 1.
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Inventors:
Osamu Yamamoto
Application Number:
JP2000087761A
Publication Date:
June 06, 2007
Filing Date:
March 28, 2000
Export Citation:
Assignee:
Nippon Electric Heat Meter Co., Ltd.
International Classes:
B23K1/08; B23K31/02; H05K3/34; B23K101/42; (IPC1-7): B23K1/08; B23K31/02; H05K3/34; //B23K101:42
Domestic Patent References:
| JP62112982A |
Attorney, Agent or Firm:
Masataka Kobayashi
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