Title:
FLOWABLE CHIP, AND METHOD FOR USING THE SAME
Document Type and Number:
Japanese Patent JP2009184922
Kind Code:
A
Abstract:
To solve such a problem that conventional granular polycrystalline silicon has too low purity irrespective of a process used for recharging a granular material depending on applications.
Flowable chips are a polycrystalline silicon piece group which comprises polycrystalline silicon pieces prepared by a chemical vapor deposition process and having bulk impurities at a level not exceeding 0.03 ppma and surface impurities at a level not exceeding 15 ppba, and which moreover has a controlled particle size distribution and generally has nonspherical morphology.
Inventors:
ARVIDSON ARVID NEIL
HORSTMAN TERENCE LEE
MOLNAR MICHAEL JOHN
SCHMIDT CHRIS TIM
SPENCER ROGER DALE JR
HORSTMAN TERENCE LEE
MOLNAR MICHAEL JOHN
SCHMIDT CHRIS TIM
SPENCER ROGER DALE JR
Application Number:
JP2009128250A
Publication Date:
August 20, 2009
Filing Date:
May 27, 2009
Export Citation:
Assignee:
HEMLOCK SEMICONDUCTOR CORP
International Classes:
C30B29/06; C01B33/02; C01B33/037; C30B15/02
Domestic Patent References:
JPS6483591A | 1989-03-29 | |||
JP2000302594A | 2000-10-31 | |||
JP2000302594A | 2000-10-31 | |||
JPH1015422A | 1998-01-20 | |||
JPH06100394A | 1994-04-12 | |||
JP2001019594A | 2001-01-23 | |||
JP2000247623A | 2000-09-12 | |||
JPS5854115B2 | 1983-12-02 |
Other References:
JPN6014045126; 高純度化技術体系 第3巻 高純度物質製造プロセス , 19971212, 808-809, 株式会社 フジ・テクノシステム
JPN6012038088; 高田利幸: '多結晶シリコン材料' 電子材料 , 199311, p. 27-31
JPN6012038089; UCS半導体基盤技術研究会編: シリコンの科学 , 19960628, p. 19, 株式会社リアライズ社
JPN6012038088; 高田利幸: '多結晶シリコン材料' 電子材料 , 199311, p. 27-31
JPN6012038089; UCS半導体基盤技術研究会編: シリコンの科学 , 19960628, p. 19, 株式会社リアライズ社
Attorney, Agent or Firm:
Michiharu Soga
Hidetoshi Furukawa
Suzuki Kenchi
Kajinami order
Hidetoshi Furukawa
Suzuki Kenchi
Kajinami order