Title:
FLOWER ARRANGEMENT AID
Document Type and Number:
Japanese Patent JP2002058577
Kind Code:
A
Abstract:
To provide a flower arrangement aid allowing flowers to be arranged in relatively free layout in a vase, and avoiding troubles even after being used repeatedly.
A metallic first annular plate 1 having a rectangular outer contour and a metallic second annular plate 2 having a rectangular outer contour are assembled to each other, with the outer edge 10 of the first annular plate 1 and the outer edge 20 of the second annular plate 2 situated on approximately the same plane, and the surface 21 of the second annular plate 2 being approximately perpendicular to the surface 11 of the first annular plate 1.
Inventors:
Ohashi, Chikako
Application Number:
JP2000000251947
Publication Date:
February 26, 2002
Filing Date:
August 23, 2000
Export Citation:
Assignee:
KOYO:KK
International Classes:
A47G7/02; A47G7/00; (IPC1-7): A47G7/02