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Title:
流体封入組立体およびその製造方法
Document Type and Number:
Japanese Patent JP7445968
Kind Code:
B2
Abstract:
To eliminate the necessity for arranging a dimensional surplus amount by taking into consideration a thermal influence at the joining of members and to decrease a device outside diameter D1, in a fluid-sealed assembly.SOLUTION: A fluid-sealed assembly comprises a dish-shaped member 12, a lid-shaped member 13, and a diaphragm 14 arranged between the dish-shaped member and the lid-shaped member. Both the dish-shaped member and the lid-shaped member have member main body parts 12a, 13a which form an internal space, and flange parts 12b, 13b hanging outward from peripheral edges of the member main body parts. The diaphragm is joined to the dish-shaped member and the lid-shaped member so as to be gripped by the flange part of the dish-shaped member and the flange part of the lid-shaped member at its peripheral edge part, and a fluid-sealed space 21 for sealing fluid therein is formed between the member main body part of the lid member and the diaphragm. The flange part of the dish-shaped member, the peripheral edge part of the diaphragm, and the flange part of the lid-shaped member are joined to one another by windingly fastening them in a roll shape by making them superimposed on one another.SELECTED DRAWING: Figure 1

Inventors:
Kunitoshi Imai
Takashi Motegi
Application Number:
JP2020092812A
Publication Date:
March 08, 2024
Filing Date:
May 28, 2020
Export Citation:
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Assignee:
Fuji Koki Co., Ltd.
International Classes:
F16J3/02; F16J15/52; F16K31/68
Domestic Patent References:
JP2020071006A
JP58016746A
JP2000301986A
JP2013060944A
Attorney, Agent or Firm:
Naomichi Masuko