Title:
FLUID DEVICE
Document Type and Number:
Japanese Patent JP2017118681
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To reduce the distortion of an opening for pipe connection disposed on an outer peripheral surface of a piping joint, without increasing the size of the piping joint in a fluid device.SOLUTION: A fluid device includes: piping joints (70, 71) connected to a fluid machine (W); and a plurality of fluid circulation pipes (51, 52, 61, 62) which circulate a cooling fluid to liquid cool at least one of a rotary electric machine (G) and a power conversion control device (20). The piping joints (70, 71) are of a wafer type in which a plurality of holes (70b, 70c, 71b, 71c) are formed on the outer peripheral surface to connect the fluid circulation pipes (51, 52, 61, 62), so as to supply a part of the fluid to the fluid circulation pipes (51, 52, 61, 62) as the cooling fluid, or to drain the cooling fluid which flows from the fluid circulation pipes.SELECTED DRAWING: Figure 1
Inventors:
SAKAMOTO TOMOKI
IKEGAMI HIROYUKI
IKEGAMI HIROYUKI
Application Number:
JP2015251399A
Publication Date:
June 29, 2017
Filing Date:
December 24, 2015
Export Citation:
Assignee:
DAIKIN IND LTD
International Classes:
H02K7/14; F04B39/12; F16L25/00; H02K7/18
Attorney, Agent or Firm:
Maeda patent office
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