Title:
POLISHING TAPE, MANUFACTURE THEREOF, AND DEVICE THEREFOR
Document Type and Number:
Japanese Patent JP3152968
Kind Code:
B2
Abstract:
PURPOSE: To provide a polishing tape to which ultrafine abrasive grains are uniformly stuck by appropriate bonding power.
CONSTITUTION: This polishing tape 1 is provided with a conductive thin film layer 3 on one face of a insulting base material film 2, and an abrasive grain layer 4 is formed on the surface of the conductive thin film layer 3. The abrasive grain layer 4 is formed by sticking silica particles 5 of ultrafine abrasive grains by an electrophoresis method. At manufacturing this polishing tape 1, a base film consisting of the base material film 2 and the conductive thin film layer 3 is passed through colloidal silica dispersed with silica particles 5 therein and electric field is formed between the colloidal silica and the thin film layer 3 by applying voltage on the conductive thin film layer 3.
Inventors:
Yasuhiro Tani
Junichi Ikeno
Junichi Ikeno
Application Number:
JP24248791A
Publication Date:
April 03, 2001
Filing Date:
August 29, 1991
Export Citation:
Assignee:
Japan Science and Technology Agency
International Classes:
B24D11/00; (IPC1-7): B24D11/00
Domestic Patent References:
| JP2262965A | ||||
| JP2185375A | ||||
| JP63191575A | ||||
| JP6374524A | ||||
| JP5344714B2 |
Attorney, Agent or Firm:
Yasuyuki Morishita
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