Title:
カバー層に中断部を備えた流体吐出デバイス
Document Type and Number:
Japanese Patent JP7217354
Kind Code:
B2
Abstract:
In various examples, a fluid ejection device may include a fluid ejection die formed with a first material and that includes a bondpad and a plurality of fluid ejectors, and a cover layer adjacent the fluid ejection die. The cover may be formed with a second material that is different than the first material and may include a first region that overlays the bondpad and a second region that overlays the plurality of fluid ejectors. In various examples, the first and second regions are separated by a break in the cover layer. The break may be filled with a third material that is different than one or both of the first and second material.
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Inventors:
Cambie, Michael, W
Fuller, Anthony, M
Chen, Chiang-Hue
Fuller, Anthony, M
Chen, Chiang-Hue
Application Number:
JP2021541259A
Publication Date:
February 02, 2023
Filing Date:
April 29, 2019
Export Citation:
Assignee:
Hewlett-Packard Development Company L.P.
Hewlett-Packard Development Company, L.P.
Hewlett-Packard Development Company, L.P.
International Classes:
B41J2/14; B41J2/16
Domestic Patent References:
| JP2006297827A | ||||
| JP2002079675A | ||||
| JP2015223832A | ||||
| JP2008006812A | ||||
| JP2012030400A | ||||
| JP2007055071A | ||||
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| JP2016508461A | ||||
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| JP2018202806A | ||||
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Foreign References:
| US20110025780 | ||||
| US20170028722 |
Attorney, Agent or Firm:
Satoshi Furuya
Akihiro Onishi
Rei Hosoi
Akihiro Onishi
Rei Hosoi