Title:
フッ素系樹脂含有ポリイミド前駆体溶液組成物、それを用いたポリイミド、ポリイミドフィルム、およびそれらの製造方法
Document Type and Number:
Japanese Patent JP7093608
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a fluorine-based resin containing polyimide precursor solution composition which can sufficiently remove an additive in an imidization reaction when polyimide is produced and can more effectively reduce a dielectric constant and a dielectric loss tangent, even when an additive for polyimide becoming a factor for increasing the dielectric constant and the dielectric loss tangent is added; polyimide, a polyimide film and a polyimide insulating material which are obtained by the composition and are excellent in heat resistance, mechanical characteristics, electric characteristics (low dielectric constant and low dielectric loss tangent) and workability and a method for producing them; and a circuit board, a coverlay film and electric equipment using the polyimide film.SOLUTION: A fluorine-based resin containing polyimide precursor solution composition contains at least micropowder of a fluorine-based resin, an additive which shows a weight reduction ratio at 280°C or lower with respect to an initial weight of a solid content of 10% or less and shows a weight reduction ratio at 380°C or higher of 90% or more, a tetracarboxylic acid dihydrate and/or a derivative thereof, a diamine compound and a nonaqueous solvent.SELECTED DRAWING: None
Inventors:
Atsushi Sato
Application Number:
JP2015205739A
Publication Date:
June 30, 2022
Filing Date:
October 19, 2015
Export Citation:
Assignee:
MITSUBISHI PENCIL CO.,LTD.
International Classes:
C08L79/08; B32B15/088; B32B27/18; B32B27/34; C08G73/10; C08J5/18; C08L27/12; H01B3/30; H01B3/44; H01B17/56
Domestic Patent References:
| JP2005142572A |
Foreign References:
| WO2015152240A1 |
Attorney, Agent or Firm:
Eisuke Fujimoto
Masayoshi Kanda
Akishige Miyao
Baba Nobuyuki
Masayoshi Kanda
Akishige Miyao
Baba Nobuyuki