Title:
FLUORINE-CONTAINING CARBOXYLATE COMPOUND
Document Type and Number:
Japanese Patent JP2022045347
Kind Code:
A
Abstract:
To provide a manufacturing method or the like of a fluorine-containing carboxylate compound (preferably, a fluorine-containing carboxylate compound with a low water content) as an additive for an electrochemical device.SOLUTION: Provided is a manufacturing method of a compound represented by formula (P1):(B1f)mp(A1)np [B1f is RfCOO; Rf is carbohydrate having at least one F atom; A1 is a group excluding H; mp is 1 or 2 obtained by (valence of A1)×np; np is 1 obtained by mp/(valence of A1); a valence of A1 is 1 or 2]. The method includes a step A of reacting a compound represented by formula (S1):(B1f)(R1) [B1f is the same as mentioned above; R1 is an organic group], with a compound represented by formula (S2): (A1)ms2(B2)ns2 [A1 is a group excluding H; B2 is OH, CO3 or HCO3; ms2 is 1 or 2 obtained by (valence of B2)×ns2/(valence of A1); ns2 is 1 or 2 obtained by (valence of A1)×ms2/(valence of B2)], or its hydrate.SELECTED DRAWING: None
Inventors:
SHIRAI ATSUSHI
YAMAZAKI JOKI
KUROKI MASACHIKA
OTSUKA TATSUYA
YAMAZAKI JOKI
KUROKI MASACHIKA
OTSUKA TATSUYA
Application Number:
JP2021144392A
Publication Date:
March 18, 2022
Filing Date:
September 06, 2021
Export Citation:
Assignee:
DAIKIN IND LTD
International Classes:
C07C51/09; C07C53/18; C07C53/21; C07F1/02; H01G11/64; H01M10/052; H01M10/0567
Domestic Patent References:
| JP2004022379A | 2004-01-22 | |||
| JPS53146708A | 1978-12-20 | |||
| JPS56125500A | 1981-10-01 | |||
| JP2011093808A | 2011-05-12 | |||
| JP2018156761A | 2018-10-04 | |||
| JP2019003955A | 2019-01-10 | |||
| JP2003045481A | 2003-02-14 | |||
| JP6608013B1 | 2019-11-20 |
Foreign References:
| WO2008078626A1 | 2008-07-03 | |||
| WO2011000804A1 | 2011-01-06 | |||
| WO2010092977A1 | 2010-08-19 | |||
| WO2011034162A1 | 2011-03-24 | |||
| WO2019151813A1 | 2019-08-08 |
Attorney, Agent or Firm:
Patent Business Corporation Saegusa International Patent Office
Previous Patent: JPWO2022045346
Next Patent: Systems and methods for joining electronic components on substrates with rough surfaces
Next Patent: Systems and methods for joining electronic components on substrates with rough surfaces