To provide fluororesin fiber paper capable of being used in producing a printed board through a simple production method, excellent in adhesion to copper foil, having low water absorption, and having a high dielectric constant and a low dielectric dissipation factor so as to be suitably used as a base material of the printed board for high frequency use.

In this fluororesin fiber paper comprising a paper-like material which contains the fluororesin fiber as a main component, the paper-like material contains inorganic fine particles, and the fluororesin is adhered to the surface of the paper-like material. The method for producing the fluororesin fiber paper comprises agglomerating the inorganic fine particles to form agglomerated particles, mixing the aggregated particles with the fluororesin fiber, subjecting the mixture to papermaking through a wet papermaking process to form the paper-like material, adhering the fluororesin to the surface of the paper-like material, heating the paper-like material at a temperature not lower than the melting point of the fluororesin fiber, and fusing connecting points between the fibers and between the fiber and the inorganic fine particle.