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Title:
FLUX COMPOSITION, SOLDER COMPOSITION, AND ELECTRONIC SUBSTRATE
Document Type and Number:
Japanese Patent JP2014087814
Kind Code:
A
Abstract:

To provide a flux composition which suppresses generation of missing bump and in which there is few remaining scraper of the solder composition during printing when the flux composition is formed into the solder composition, the solder composition, and an electronic substrate on which an electronic component is mounted by using the solder composition.

The flux composition includes rosin resin, solvent, an organic acid, and a thixotropic agent. The solvent is made by mixing polyalkylene glycol monoalkyl ether and polyalkylene glycol dialkyl ether. The particle diameter of the thixotropic agent in the composition is 10 μm or less in measurement by fineness of grind gage.


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Inventors:
IIJIMA NORINARI
SAITO MITSUKI
ONO TAIICHI
KIMURA HITOMI
TACHIBANA MICHIZOU
Application Number:
JP2012238243A
Publication Date:
May 15, 2014
Filing Date:
October 29, 2012
Export Citation:
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Assignee:
TAMURA SEISAKUSHO KK
International Classes:
B23K35/363; B23K1/00; H05K3/34; B23K101/42; C22C13/00
Domestic Patent References:
JPH07290277A1995-11-07
JPH0377793A1991-04-03
JPH10189098A1998-07-21
JP2001347395A2001-12-18
JPS63303695A1988-12-12
JPH07132395A1995-05-23
JP2004291019A2004-10-21
Foreign References:
WO2011076770A22011-06-30
WO2006095417A12006-09-14
Attorney, Agent or Firm:
Intellectual Property Office



 
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