Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
FLUX COMPOSITION AND SOLDER COMPOSITION
Document Type and Number:
Japanese Patent JP2014188578
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a flux which is excellent in solder spreading and solder melting properties, and can prevent discoloration of a copper foil after soldering, when being formed into a solder composition.SOLUTION: A flux composition is a flux composition containing a resin and an active agent. The active agent contains an iodine-based carboxyl compound.

Inventors:
NAKANO KEN
HARASHIMA KEITA
YAMASHITA NOBUHIRO
Application Number:
JP2013069038A
Publication Date:
October 06, 2014
Filing Date:
March 28, 2013
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
TAMURA SEISAKUSHO KK
International Classes:
B23K35/363
Domestic Patent References:
JP2010094719A2010-04-30
JP2006205203A2006-08-10
JP2003001487A2003-01-08
Attorney, Agent or Firm:
Bottom intellectual property office of patent business corporation Tatsuyuki



 
Previous Patent: HEMMING PROCESSING METHOD AND DEVICE

Next Patent: MANUFACTURING METHOD OF EXTREMELY THICK AUSTENITIC STAINLESS THICK STEEL PLATE EXCELLENT IN INNER QU...