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Title:
フラックス内包カプセル、フラックス内包カプセル付き導電性粒子及び接続構造体
Document Type and Number:
Japanese Patent JP5139932
Kind Code:
B2
Abstract:

To provide a flux-containing capsule which sufficiently removes any oxide film on the surface of a conductive particle, and reduces the connection resistance between the electrodes when attached to a surface of the conductive particle having a metallic layer on the surface and used for connection between electrodes, and to provide the conductive particle with the flux-containing capsule using the flux-containing capsule.

The flux-containing capsule 3 is attached to the surface 2a of the conductive particle 2 with the metallic layer on the surface 2a and is used. The flux-containing capsule includes a flux 4 and a coating film 5 containing the flux 4 and formed of polymer. In the flux-containing capsule 3, the glass-transition temperature of the polymer is ≥100°C, and equal to or lower than the melting point of the metallic layer. In the conductive particle 1 with the flux-containing capsule, the flux-containing capsule 3 is attached to the surface 2a of the conductive particle 2.

COPYRIGHT: (C)2010,JPO&INPIT


Inventors:
Hiroshi Yamauchi
Kubota Keishi
Application Number:
JP2008237699A
Publication Date:
February 06, 2013
Filing Date:
September 17, 2008
Export Citation:
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Assignee:
Sekisui Chemical Co.,Ltd.
International Classes:
B23K35/363; B23K3/00; B23K3/06; H01B5/00; H01L21/60; H01R4/02; H01R11/01; H05K3/34; B23K101/42
Domestic Patent References:
JP2005149764A
JP2003247083A
JP2007258141A
JP11047978A
Attorney, Agent or Firm:
宮▲崎▼ 主税
Table of contents Makoto