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Title:
FLUX FOR LEAD-FREE SOLDER, LEAD-FREE SOLDER PASTE AND LEAD-FREE WIRE SOLDER
Document Type and Number:
Japanese Patent JP2013173184
Kind Code:
A
Abstract:

To provide a flux composition having satisfactory wettability, and in which cracks are hard to be generated on flux residue.

A flux for lead-free solder including dimer acid dialkyl ester (A) is used. The flux further includes rosins (B): an activator (C); a thixotropic agent (D); a solvent for a flux (E); and an antioxidant (F).


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Inventors:
ODA TAKESHI
KUBO NATSUKI
ISHIGA FUMIO
Application Number:
JP2013009493A
Publication Date:
September 05, 2013
Filing Date:
January 22, 2013
Export Citation:
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Assignee:
ARAKAWA CHEM IND
International Classes:
B23K35/363; B23K35/14; B23K35/26; C22C13/00; C22C13/02
Domestic Patent References:
JP2004230426A2004-08-19
JP2009178752A2009-08-13
JPH04200992A1992-07-21
JPH0655258A1994-03-01
JPS56141997A1981-11-05
JP2003275892A2003-09-30
JP2008110392A2008-05-15
JPS62137192A1987-06-20
JPS62137192A1987-06-20
JP2004230426A2004-08-19
JP2009178752A2009-08-13
JPH04200992A1992-07-21
JPH0655258A1994-03-01
JPS56141997A1981-11-05
JP2003275892A2003-09-30
JP2008110392A2008-05-15



 
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