Title:
FLUX FOR RESIN FLUX CORED SOLDER AND RESIN FLUX CORED SOLDER
Document Type and Number:
Japanese Patent JP2015033714
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide flux for resin flux cored solder which is excellent in storage stability and productivity and contains thermosetting resin and to provide resin flux cored solder made by incorporating the flux for resin flux cored solder.SOLUTION: There is provided flux for resin flux cored solder includes first solid-state flux 11 containing a thermosetting resin and second solid-state flux 12 containing a curing agent having a redox actuation, where the first flux 11 and the second flux 12 exist in a non-contact state. Also provided is resin flux cored solder 100a which includes the flux for resin flux cored solder and a lead-free solder alloy of which melting point is 130 to 250°C, and is composed of the first resin flux cored solder 21 made by incorporating the first flux 11 into the lead-free solder alloy 2 and the second resin flux cored solder 22 made by incorporating the second flux 12 into the lead-free solder alloy 2.
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Inventors:
KARIBE TATSUYA
WATANABE HIROHIKO
WATANABE HIROHIKO
Application Number:
JP2013166281A
Publication Date:
February 19, 2015
Filing Date:
August 09, 2013
Export Citation:
Assignee:
FUJI ELECTRIC CO LTD
FUJI ELEC FA COMPONENTS & SYS
FUJI ELEC FA COMPONENTS & SYS
International Classes:
B23K35/363; B23K35/14
Attorney, Agent or Firm:
Okuyama In addition, it is 1.
Owner field Koichi
Tetsuo Matsushima
Hidefumi Kawamura
Ayako Nakamura
Morimoto Satoshi 2
Kyoko Tsunoda
Yu Tanaka
Koichi Tokumoto
Tokuji Watanabe
Owner field Koichi
Tetsuo Matsushima
Hidefumi Kawamura
Ayako Nakamura
Morimoto Satoshi 2
Kyoko Tsunoda
Yu Tanaka
Koichi Tokumoto
Tokuji Watanabe