Title:
FLUX FOR SOLDERING
Document Type and Number:
Japanese Patent JP3449778
Kind Code:
B2
Abstract:
PURPOSE: To prevent the corrosion of a base material by temp. and humidity elevation and the deterioration of electrical characteristics without executing washing and removing after soldering by adding a bis compd., dithiol compd., org. carboxylic acid compd. and activator to the flux.
CONSTITUTION: The flux contg. the bis(2-oxazoline) compd., the dithiol compd., the org. carboxylic acid compd. and the activator is a mixture composed of the compds. which respectively have high reactivity. These compds. react to form a polymer having high heat resistance, moisture resistance and toughness by heating at the time of soldering. The polymerized films of the flux residues after the soldering treatment do not crack in spite of thermal impact of heating and cooling and further, a needle comes into easy contact with circuits by a low pressure even in an in-circuit test to erect the needle on the flux treated substrate. The org. carboxylic acid to be the cause of corrosion and insulation deterioration is built into the polymer and the hydrogen halide generated from hydrogen halide salt at the time of heating reacts much with the bis compd. The unreacted residues are fixed in the polymer.
Inventors:
Tetsuro Nishimura
Kazuhiro Arita
Kazuhiro Arita
Application Number:
JP6627994A
Publication Date:
September 22, 2003
Filing Date:
April 04, 1994
Export Citation:
Assignee:
Nippon Superior Co., Ltd.
International Classes:
B23K35/363; (IPC1-7): B23K35/363
Domestic Patent References:
| JP6246481A |
Attorney, Agent or Firm:
Yoshitaka Tani (3 outside)
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