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Patent Searching and Data


Title:
FOAM PLASTIC HEAT INSULATING COMPOSITE PANEL
Document Type and Number:
Japanese Patent JP2008025099
Kind Code:
A
Abstract:

To provide a foam plastic heat insulating composite panel the warpage of which can be easily suppressed and which enables the easy fractional disassembly and fractional collection.

This foam plastic heat insulating composite panel comprises a foam plastic heat insulating board 11 having one or more fitting grooves 12 formed in an arranged direction, a foam plastic reinforcement member 13 of 450 to 560 kg/m3 in density installed for each fitting groove 12, fitted and fixed to the fitting groove 12 by using an adhesive agent, and a warpage suppressing tape 14 formed of an aluminum adhesive tape of 50 to 200 m in thickness installed on one side surface of the foam plastic reinforcement member 13 excluding the other side surface fitted to the fitting groove 12 and having a coefficient of expansion smaller than that of the foam plastic reinforcement member 13.


Inventors:
YOSHIDA TOSHIO
HARADA MITSUHIRO
YAMAMOTO SHIGETAKA
ABE YASUYUKI
INADA NORIO
KAMIBAYASHI HIDEFUMI
TATEWAKI SUGURU
Application Number:
JP2006195165A
Publication Date:
February 07, 2008
Filing Date:
July 18, 2006
Export Citation:
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Assignee:
IWAKURA KAGAKU KOGYO KK
International Classes:
E04B1/80; E04B1/16
Domestic Patent References:
JP2002235393A2002-08-23
Attorney, Agent or Firm:
Takashiro Kojima
Yasuo Kawanari
Noriko Kawai
Takuya Sato