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Title:
FOLDING ELECTRONIC APPARATUS
Document Type and Number:
Japanese Patent JP2007043379
Kind Code:
A
Abstract:

To provide a folding electronic apparatus hardly to be damaged by distributing stress generated at a connection wiring, which electrically connects both apparatus housings.

A folding electronic apparatus 1 comprises a pair of apparatus housings 2 and 10 provided with a control circuit substrate at its inside, a hinge mechanism 20 for connecting one side end of the pair of the apparatus housings each other rotatably, a connection wiring 6 for electrically connecting the pair of the apparatus housings each other. The one side end connected with the hinge mechanism of the pair of the apparatus housings has both corners 15a, 15b, 16a, and 16b projected by a predetermined length in the direction perpendicularly to the one side end, and the hinge mechanism is attached among the both corners. The hinge mechanism comprises a first rotation axis arranged among one of the both corners of the apparatus housings, and a second rotation axis arranged among the other of the both corners. The connection wiring is laid in a curved fashion along one corner and a hinge mechanism of the pair of the apparatus, and both ends of the wiring are connected to each control circuit substrate.


Inventors:
KAMIYAMA TOMOTAKE
Application Number:
JP2005224091A
Publication Date:
February 15, 2007
Filing Date:
August 02, 2005
Export Citation:
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Assignee:
SANYO ELECTRIC CO
TOKYO SANYO ELECTRIC CO
International Classes:
H04M1/02; F16C11/04; F16C11/10
Domestic Patent References:
JP2005019629A2005-01-20
JP2004047968A2004-02-12
Attorney, Agent or Firm:
Hiroshi Kakutani