Title:
GROUNDING DEVICE
Document Type and Number:
Japanese Patent JP3238284
Kind Code:
B2
Abstract:
PURPOSE: To provide a grounding device with which electrolytic conductivity by contact with the ground will not occur, and which has no possibility of corrosion or electrocorrosion to restrict increase of resistance of a grounding wire by selecting a grounding device comprising a specific constitution.
CONSTITUTION: A grounding device comprises a grounding wire 3 of which circumferential surface to be inserted into a recessed part 2 bored in the ground 1 is coated with a conductive coating body 4, a carbon grain layer 5 to be applied to a circumferential surface of the conductive coating body 4, a surrounding body 6 to surround this carbon grain layer 5, and a grounding reducing material 7 comprising carbon fibers to be disposed around the surrounding body 6. In addition, desirably, an upper protector 8a is disposed to cover part of the circumferential surface of the conductive coating body 4 exposed from the ground 1, an upper end surface of the surrounding body 6 covering the carbon grain layer 5, and part of an upper circumferential surface continuous from the upper end surface of the surrounding body 6.
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Inventors:
Daizo Shigemori
Shoji Shirai
Shigeo Wada
Makoto Ishizaki
Shoji Shirai
Shigeo Wada
Makoto Ishizaki
Application Number:
JP18551994A
Publication Date:
December 10, 2001
Filing Date:
July 14, 1994
Export Citation:
Assignee:
Sankosia Co., Ltd.
International Classes:
H01R4/66; (IPC1-7): H01R4/66
Domestic Patent References:
| JP574506A | ||||
| JP6062070A | ||||
| JP50145843A |
Attorney, Agent or Firm:
Tamotsu Hirai
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