Title:
ホルムアルデヒド不含接着剤組成物
Document Type and Number:
Japanese Patent JP7319283
Kind Code:
B2
Abstract:
A formaldehyde free adhesive composition and a plywood obtained by the adhesive composition is provided, and the plywood retains desired performances, such as water resistance and workability.
Inventors:
Hu, Minpiao
Sun, ton
Chan, Chin Kui
Bread, shi
Feng, Xiaokan
Tsai, Shiumei
Sun, ton
Chan, Chin Kui
Bread, shi
Feng, Xiaokan
Tsai, Shiumei
Application Number:
JP2020542753A
Publication Date:
August 01, 2023
Filing Date:
March 07, 2019
Export Citation:
Assignee:
Dow Global Technologies LLC
Dow Silicones Corporation
Dow Silicones Corporation
International Classes:
C09J133/04; B27D1/04; C09J11/04; C09J11/06; C09J11/08; C09J133/14; C09J143/02; C09J143/04
Domestic Patent References:
| JP62148582A | ||||
| JP11349911A | ||||
| JP58029871A |
Foreign References:
| US5480720 | ||||
| WO2017112018A1 |
Attorney, Agent or Firm:
Hiroshi Kobayashi
Eiji Katayama
Norio Omori
Yasuhito Suzuki
Eiji Katayama
Norio Omori
Yasuhito Suzuki
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