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Title:
PHOTOLITHOGRAPHY DEVICE AND EXPOSURE METHOD
Document Type and Number:
Japanese Patent JP3068785
Kind Code:
B2
Abstract:

PURPOSE: To lessen a projected image in distortion errors attendant on the change of a pattern injection region in shape or size by a method wherein a photolithography device is controlled in a projection multiplying factor to a substrate so as to make image high spots, which are located in a pattern projection region adjusted by a blind, small in amount of distortion on an average.
CONSTITUTION: Blinds BL1 and BL2 are each equipped with a movable blade to control illuminating light which irradiates masks (reticle) R1 and R2 in an illuminating range conforming to pattern regions PA1 and PA2 on the masks (reticle) R1 and R2. Multiplying factor controlling means BC1 and BC2 control a photolithography device in a projection multiplying factor to a substrate so as to make image high spots, which are located in the effective pattern projection regions of projection optical systems PL1 and PL2 corresponding to illuminating ranges adjusted by the blinds BL1 and BL2, small in amount of distortion on an average. By this setup, a projected image can be lessened in distortion error attendant on the change of a pattern projection region in shape or size.


Inventors:
Kazuaki Suzuki
Toshio Matsuura
Kyouichi Suwa
Koichi Matsumoto
Application Number:
JP2499896A
Publication Date:
July 24, 2000
Filing Date:
February 13, 1996
Export Citation:
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Assignee:
NIKON CORPORATION
International Classes:
G03F7/20; G03F9/00; H01L21/027; (IPC1-7): G03F7/20; G03F9/00; H01L21/027
Domestic Patent References:
JP6026343A
JP6076728A
JP5795536A
JP55154732A



 
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