Title:
FORMATION OF COATING FILM
Document Type and Number:
Japanese Patent JPH0992648
Kind Code:
A
Abstract:
To prevent flatness from being deteriorated in an interlayer insulating film and a flattening film for etching-back owing to the influence of a step and to prevent the line width of a pattern from being greatly varied in the formation of the line pattern.
A method is for forming a coating film 14 by applying coating liquid 13 to the surface of a substrate 11 having the step 12. Coating liquid 13 contains solvent whose value of surface tension is more than 35mN/m and less than the value of the surface tension of water. Thus, the flatness of the coating film 14 is improved and the line width variation of the pattern formed at the coating film 14 is reduced.
Inventors:
IKEDA RIKIO
Application Number:
JP24899695A
Publication Date:
April 04, 1997
Filing Date:
September 27, 1995
Export Citation:
Assignee:
SONY CORP
International Classes:
G03F7/16; B05D7/00; H01L21/027; H01L21/316; H01L21/3205; (IPC1-7): H01L21/316; B05D7/00; G03F7/16; H01L21/027; H01L21/3205
Domestic Patent References:
| JPH05214296A | 1993-08-24 | |||
| JPH06293879A | 1994-10-21 | |||
| JPH07173434A | 1995-07-11 | |||
| JPH07193061A | 1995-07-28 | |||
| JPS61228440A | 1986-10-11 |
Attorney, Agent or Firm:
Kuninori Funabashi
Next Patent: SEMICONDUCTOR ELEMENT AND CONNECTION METHOD