Title:
FORMATION FOR ELECTRODE METAL WIRING PATTERN
Document Type and Number:
Japanese Patent JPS61174638
Kind Code:
A
Abstract:
PURPOSE:To contrive to prevent the film thickness of the insulating films on the step difference parts of the side surface parts of the opening part pattern from becoming thinner and to enable to form electrode metal wiring patterns having little disconnection even on the step difference parts by a method wherein the patterns of the insulating films are formed on the side surface parts of the opening part pattern, and afer that, a metal film for electrode wiring is formed on the whole surface. CONSTITUTION:An opening part pattern 2a is formed on an interlayer insulating film 2, such as a silicon oxide film, and after that, an insulating film 6 such as a silicon nitride film is formed on the whole surface. Then, when an etching is performed on the whole surface by a reactive ion etching method, wherein a mixed gas of CF4 gas and H2 gas, for example, is used, the film thickness of insulating films 6, which are formed on the side surfaces of the opening part patterns 2a, is formed thicker compared to that of the insulating film, which nis formed on the flat part of the opening pattern 2a. Therefore, the patterns 6a of the insulating films 6 are formed on the side surfaces of the opening part pattern 2a. Here, as the angles of the upper parts of the patterns 6a on the side surface parts become round, the opening part inlets of the patterns 6a of the insulating films 6 all become a form removed sharpness. After that, when an aluminum film 5, which is the metal film for electrode wiring, is formed on the whole surface, the film thickness of aluminum films 5b on the step difference parts of the opening part pattern does not become thinner and the electrode metal wiring patterns can be formed there, while disconnection is eliminated and the covering property is improved.
Inventors:
ITAKURA HIDEAKI
Application Number:
JP1619185A
Publication Date:
August 06, 1986
Filing Date:
January 28, 1985
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
H01L21/3205; H01L21/302; H01L21/3065; (IPC1-7): H01L21/88
Attorney, Agent or Firm:
Masuo Oiwa