Title:
高密度化金属粉末を使用する電磁通信回路構成要素の形成
Document Type and Number:
Japanese Patent JP2006521023
Kind Code:
A
Abstract:
Manufacturing techniques are described for forming electrical components. For example, a layer of a metal powder composition is deposited onto at least a portion of a substrate. Pressure is applied to the metal powder composition by hydraulic press that has one or more projections in order to capture a pattern on the substrate. The metal powder composition compressed by the projections of the hydraulic press adhere to the substrate to form the captured pattern. The metal powder composition in regions not compressed by the projections of hydraulic press do not adhere to the substrate and may be removed. The metal powder composition may be compressed to form electrical components, such as antennae, capacitor plates, conduction pads and the like, for use in an electronic surveillance system (EAS), a radio frequency identification (RFID) system, or the like.
Inventors:
Coons, David W.
Kosken Maki, David Sea.
Kosken Maki, David Sea.
Application Number:
JP2006508598A
Publication Date:
September 14, 2006
Filing Date:
January 13, 2004
Export Citation:
Assignee:
3M INNOVATIVE PROPERTIES COMPANY
International Classes:
H05K1/09; G06K19/02; G06K19/067; G06K19/07; G06K19/073; G06K19/077; H05K1/16; H05K3/10; G06K17/00
Attorney, Agent or Firm:
Atsushi Aoki
Takashi Ishida
Tetsuji Koga
Nagasaka Tomoyasu
Masaya Nishiyama
Takashi Ishida
Tetsuji Koga
Nagasaka Tomoyasu
Masaya Nishiyama