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Patent Searching and Data


Title:
FORMATION OF EMBOSSED PATTERN
Document Type and Number:
Japanese Patent JPS618172
Kind Code:
A
Abstract:

PURPOSE: To simply form a deep embossed pattern, by a method wherein a paint impervious sheet is placed on the aqueous putty layer applied to a substrate and a water resistant spontaneous curable paint is applied onto the uncovered putty layer and, after curing, the part having no paint applied thereto is removed.

CONSTITUTION: Aqueous putty is applied to a substrate and dried to form a putty layer which a sheet (e.g., silk screen), to which a pattern was formed by a paint pervious part and a paint impervious part, is placed on said putty layer or paint impervious sheets are placed thereon in a pattern form. Thereafter, a water resistant spontaneous curable paint is applied to the putty layer not covered by the paint impervious part or the paint impervious sheets. Next, said sheet is removed and the paint film on the putty layer is cured while a part or the whole of the putty layer having no paint film applied thereto is removed by washing. By this method, an embossed pattern having an arbitrary depth and deep unevenness can be obtained simply and inexpensively.


Inventors:
TANAKA SATOSHI
SAKURABA TOSHIHIKO
MAEDA HIROMI
MATSUDA MITSUHIRO
KOUNO MITSURU
YUASA TAKAHIRO
OONO TOSHIHARU
Application Number:
JP13061384A
Publication Date:
January 14, 1986
Filing Date:
June 25, 1984
Export Citation:
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Assignee:
DAINIPPON TORYO KK
International Classes:
B05D5/06; B05D7/24; B44C1/00; (IPC1-7): B05D5/06; B44C1/00
Attorney, Agent or Firm:
Minoru Nakamura