PURPOSE: To rapidly form a fine pattern of metallic film by vapor-depositing a metallic film onto a substrate on which a lift off mask is previously formed, allowing the metallic film on the masked part alone to adhere to a sheet while leaving the metallic film on the substrate, and then peeling off the above sheet.

CONSTITUTION: A patterned lift off mask 1 is formed on the surface of a substrate 2. A metallic film 3 (e.g., of gold) is formed on the above mask 1 by means of vapor deposition, etc. Subsequently, the above substrate 2 is immersed in a solvent or etchant to undergo the removal of the above mask 1. Then, a pressure sensitive adhesive sheet 4 is stuck over the whole surface of the above metallic film 3, and this sheet 4 is peeled off. By this method, the metallic film 3 on the above mask 1 alone is allowed to adhere to the above sheet 4 and is peeled off, and the metallic film 3 directly vapor-deposited onto the substrate 2 is left, by which the fine pattern can be formed.