Title:
FORMATION OF HEAT-SINKED ELECTRONIC COMPONENT AND ELECTRONIC COMPONENT
Document Type and Number:
Japanese Patent JP3445393
Kind Code:
B2
Abstract:
PURPOSE: To inexpensively provide a heat sink material of an electronic component consisting of a synthetic diamond layer used for heat management of the electronic component and circuit.
CONSTITUTION: The method for forming the heat-sinked electronic component includes the following steps: depositing a first layer of synthetic diamond having a relatively high thermal conductivity at a first deposition rate; depositing a second layer of synthetic diamond having a relatively low thermal conductivity on the first layer at a second deposition rate that is higher than the first deposition rate; and mounting the electronic component on the first layer of the synthetic diamond described above. The thermal conductivity of the first layer is larger by at least 15% than the thermal conductivity of the second layer. The second layer is as thick as at least twice the first layer.
Inventors:
Matthew Simpson
Application Number:
JP32728394A
Publication Date:
September 08, 2003
Filing Date:
December 28, 1994
Export Citation:
Assignee:
Saint-Gobain Ceramics and Plastics, Incorporated
International Classes:
C01B31/06; C30B29/04; H01L23/373; (IPC1-7): C30B29/04; H01L23/373
Domestic Patent References:
| JP5306193A | ||||
| JP63307196A | ||||
| JP60208852A | ||||
| JP649882A | ||||
| JP2233592A | ||||
| JP5221792A | ||||
| JP6234595A |
Other References:
【文献】欧州特許出願公開495479(EP,A1)
Attorney, Agent or Firm:
Takashi Ishida (3 others)