FORMATION OF METALLIC LAYER ON RESIN SUBSTRATE - MATSUSHITA ELECTRIC WORKS LTD

Title:

FORMATION OF METALLIC LAYER ON RESIN SUBSTRATE

Document Type and Number:

Japanese Patent JPS60251276

Kind Code:

A

Abstract:

PURPOSE: To improve the bonding strength of a metallic layer to a resin substrate and the heat resistance by irradiating the metallic layer formed on the resin substrate consisting of polyphenylene oxide and resin which is cross- linkable under radiation to cross-link the resin.

CONSTITUTION: A resin substrate is made of a composition consisting of 10W 90wt% polyphenylene oxide and 90W10wt% resin which is well cross-linkable under radiation. A metallic layer is formed on the surface of the substrate and irradiated to cross-link the resin. By this method the resin is cross-linked after forming the metallic layer on the surface of the substrate, so the bonding strength of the metallic layer to the resin substrate and the heat resistance are improved.

Inventors:

ITOU MUNEHIKO
KITSUTA YOSHIHIRO

Application Number:

JP10710584A

Publication Date:

December 11, 1985

Filing Date:

May 25, 1984

Export Citation:

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Assignee:

MATSUSHITA ELECTRIC WORKS LTD

International Classes:

H05K3/38; C08L7/00; C08L21/00; C08L23/00; C08L33/00; C08L33/02; C08L71/00; C08L71/12; C08L77/00; C08L101/00; C23C14/20; C23C14/22; C23C18/20; H05K1/03; (IPC1-7): C08L71/04; C23C14/22; C23C18/20; H05K1/03

Attorney, Agent or Firm:

Shigeji Sato (1 person outside)

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