Title:
FORMATION OF METALLIC PATTERN
Document Type and Number:
Japanese Patent JPS6462491
Kind Code:
A
Abstract:
PURPOSE:To exactly form a fine rugged pattern by coating a substrate surface with a nonmetallic protective film, then forming a resist pattern thereon in tight contact therewith. CONSTITUTION:A 1st resist film 13 having low exposing sensitivity is formed on the substrate 10 and a 2nd resist film 14 having high exposing sensitivity and good adhesiveness to the film 13 is formed thereon; following which a photoresist pattern 15 is formed only on the film 14 by a conventional method using a mask having the prescribed pattern. A metallic coating 17 is then formed thereon by a plating method and the outside surface 17A thereof is corrected to a smooth surface and is adhered to a base plate member 18; thereafter, the substrate 10 formed with the resist pattern 15 consisting of the film 13 and the film 14 is stripped from the metallic film 17 to form the metallic pattern 19 reverse from the resist pattern 15. The infiltration of the plating liquid to the boundary faces between the films 13 and 14 is thereby prohibited in the above-mentioned plating stage. The very small rugged pattern which is entirely free from collapsion in shape is thus extremely exactly formed on the metallic surface.
Inventors:
SUGIMOTO MASARU
MATSUZAKA MASAAKI
NAGASHIMA MASAMI
HATTORI SHUZO
UCHIDA ETSUYUKI
MATSUZAKA MASAAKI
NAGASHIMA MASAMI
HATTORI SHUZO
UCHIDA ETSUYUKI
Application Number:
JP21710787A
Publication Date:
March 08, 1989
Filing Date:
August 31, 1987
Export Citation:
Assignee:
NIPPON SEIKO KK
International Classes:
C25D1/00; C23C18/16; C23C18/18; C23C18/31; C23C18/34; C25D1/10; (IPC1-7): C23C18/16; C25D1/00
Attorney, Agent or Firm:
Tetsuya Mori (2 others)