PURPOSE: To obtain a highly reliable connection contact by a method wherein, after a metal paste composed mainly of a low-melting-point alloy or metal has been formed on the surface of a support base material, the face of a fine terminal electrode on an element is aligned with and compression-bonded to the face of the metal paste and the metal paste is transferred to the fine terminal electrode.
CONSTITUTION: A metal paste 2 composed mainly of a low-melting-point alloy or metal is formed as a smooth face on the surface of a support base material 1 by sliding and moving a squeegee while a prescribed gap is kept. Then, a bump 6 formed on an electrode pad 5 on an IC chip 4 is brought to face and compression-bonded to a metal-paste face 2b. Thereby, the metal paste 2 is transferred to the bump 6, and an electric connection contact is formed. The electric connection contact 6 composed of the metal paste 2 and an Au thick-film electrode 7 on a ceramic board 8 are brought to face each other and compression-bonded to the bump 6 on the IC chip 4. Thereby, the IC chip can be connected to the Au thick-film electrode on the ceramic board. Thereby, the connection contact can be formed on a fine terminal electrode on an element simply and with good reliability.
WATANABE HIROTOSHI
HATAKEYAMA AKIHITO
