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Patent Searching and Data


Title:
FORMATION OF ORGANIC THIN FILM ON METALLIC PLATE
Document Type and Number:
Japanese Patent JPH02144177
Kind Code:
A
Abstract:

PURPOSE: To form an organic thin film excellent in adhesive properties on a metallic plate and industrial productivity by treating the metallic plate with a coupling agent having an unsaturated double bond and drying this metallic plate and applying a monomer capable of being polymerized by electron beams thereto and irradiating the monomer with electron beams to polymerize this monomer.

CONSTITUTION: A metallic plate is treated with a coupling agent (e.g., silane coupling agent and titanate coupling agent, etc.,) having an unsaturated double bond. Hydroxyl group is produced by hydrolyzing the hydrolytic group of the coupling agent. Then both hydroxyl group and the hydroxyl group of hydroxide existing on the surface of metal are dehydrated and condensed. Thereby the coupling agent is tightly and closely stuck on the surface of metal. Then a monomer capable of being polymerized by electron beams (especially a hydrophobic monomer having perfluoroalkyl group is preferable) is applied to this coupling agent and irradiated with electron beams. Thereby the monomer is successively polymerized while keeping the unsaturated double bond of the coupling agent as a starting point and an organic thin film is formed which is tightly and closely stuck to the coupling agent. The title formation is industrially efficient and favorable.


Inventors:
KOSHIISHI KENJI
YANO HIROKAZU
MORI KOJI
MASUHARA KENICHI
Application Number:
JP29896388A
Publication Date:
June 01, 1990
Filing Date:
November 26, 1988
Export Citation:
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Assignee:
NISSHIN STEEL CO LTD
International Classes:
B05D7/14; B05D3/06; B05D7/24; (IPC1-7): B05D3/06; B05D7/14; B05D7/24
Attorney, Agent or Firm:
Shindo Mitsuru