Title:
FORMATION OF STENCIL FOR LIFTING OFF
Document Type and Number:
Japanese Patent JPS58145129
Kind Code:
A
Abstract:
PURPOSE:To make the stencil to be provided with the base part of the desired shape and size having favorable controllability at manufacture of a Josephson integrated circuit, etc., by a method wherein exposure of the base part and the cap part of the stencil are performed independently respectively. CONSTITUTION:A positive type first photo resist is applied to a substrate 31, and exposure is performed using a photo mask 32 to form the exposed parts 33 and the unexposed part 34. Al is evaporated to form a protective layer 35, and a positive type second photo resist 36 is applied thereon. Positioning, exposure and development are performed using a photo mask to form the desired stencil cap part, and the protective layer 35 is etched. By removing the exposed parts 33, the stencil whose second photo resist layer 36 having the pattern of the desired stencil cap part is stacked on the unexposed part 34 having the pattern of the desired stencil base part interposing the protective layer 35 between them can be obtained. The shape and size thereof are determined by exposure using the photo mask 32, and are independent completely of the shape and size of the pattern of the cap part.
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Inventors:
YOSHIDA TAKUKATSU
Application Number:
JP2712282A
Publication Date:
August 29, 1983
Filing Date:
February 22, 1982
Export Citation:
Assignee:
NIPPON ELECTRIC CO
International Classes:
H01L21/306; H01L21/027; H01L21/302; H01L21/3065; (IPC1-7): H01L21/306
Attorney, Agent or Firm:
Uchihara Shin